The new processor - expected to be launched with the next generation of high-end smartphones in the first half of 2016 - follows Qualcomm's major disappointment with the Snapdragon 810 processor, which has suffered a bad reputation for its high temperature.
The new processor offers a range of features that are of interest to users such as its support for rapid charging (Quick Charge 3.0) and a faster central processing core, and a more powerful graphics and images processor.
It has four 2.2-GHz Kryo cores, and the company says it will be two times more powerful and efficient than the Snapdragon 810 processor thanks to its new 14-nanometer technology.
The company moved to the design of its ARM kernel after using Cortex A57 and Cortex A53 in the Snapdragon 808 and Snapdragon 810 processors.
The new processor includes a new image signal processor that gives the phone the ability to shoot images up to 28 megapixels, and allows more computing power to process data coming from the latest sensors of the camera.
It also includes the HEXAGON 680 DSP (digital signal processor), which offers outstanding battery performance, as well as an Adreno 530 graphics processor that delivers a 40% improvement in graphics performance and computing capabilities with less power consumption than the Adreno graphics processor 430.
The new processor also features an X12 LTE modem that supports the latest generation of 4G networks and offers three times higher peak speeds compared to the X10LTE modem and 33 download speeds % At peak time.
The processor also supports three-band Wi-Fi and supports very high "up and down" speeds of up to 600 Mbps, but it will take some time before it arrives in commercial format to users.